Primary Duties & Responsibilities

• Control, optimize, and develop substrate slicing manufacturing processes. Contribute to ideas, concepts, approaches, and engineering solutions.
• Focus on wafering technological processes with the goals of improving yields, throughput and meeting customer and business requirements.
• Ensure that each technological step is properly documented, reviewed, validated, approved and provides feedback to the R& D Center that will help improve manufacturing processes, improve yield and lower cost.
• Use statistical tools (SPC, DOE, etc.) to characterize the wafering processes to determine process capability and reliability while identifying bottlenecks. Analyze process/product failure modes and provides feedback for process optimization.
• Adhere to project timelines and effectively communicates project progress and challenges.
• Provide technical and engineering support to the manufacturing team. Instruct and train process operators and technicians.
• Establish the technological process steps of commercial substrate wafering. Ensure that each operational process step is performed in accordance with our standard procedures.
• Perform process and equipment troubleshooting, problem identification, and corrective action activities.
• Assist with planning, scheduling, and resource allocation for all wafering related items.
• Participate in R& D Programs by organizing and carrying out project activities. Adhere to the project timelines and milestones
• Summarize experimental results in formal or informal written and oral reports. Participate in technology meetings by providing reports, plans, meeting minutes, action items and other requested documentation.
• Contribute to the work of the quality assurance team by providing expertise in process characterization. Serve as a resource to the QA personnel with respect to the characterization techniques, equipment, and procedures.
• Actively participate in characterization of substrates. Analyze the obtained characterization data to establish fundamental trends and correlations and to develop scientifically sound conclusions. Use the results of characterization to establish factors that affect wafer quality and make recommendations for technology optimization.
• Communicate experimental and analytical results to the SiC substrate team in a timely manner to accelerate technological progression.

Education & Experience

• Bachelors degree with 7 years of related experience, MS with 5 years experience, or PhD with 3 years of experience in Mechanical Engineering, Materials' Science, Physics, Chemistry, or related STEM disciplines.
• Minimum of 3-7 years of hands-on experience with process control and development in an industrial manufacturing setting. Experience requirements scale with degree relevance and level. Substrate slicing and/or grinding experience preferred.
• Experience analyzing and interpreting characterization data for wafer shape. Hands-on measurement experience is preferred.
• Experience with statistical analysis tools such as JMP, Minitab, or R.
• General knowledge of semiconductor materials, technological processes used in their manufacturing and methods of materials characterization.
• Demonstrated ability to achieve results independently and working with others.
• Strong ability to multitask on numerous development fronts while maintaining process control (yields and process stability).
• Ability to recommend and implement improvements.
• Excellent interpersonal and communication skills.

Skills

• Knowledge of substrate slicing and/or grinding process and product KPIs.
• Ability to manage multiple projects while adhering to strict project timelines.
• Effectively manages multiple priorities involving external and internal priorities.
• Fluency with programs and tools used for data collection, analysis, modeling and plotting, such as Excel or similar.
• Excels in a cross-organizational, cross-cultural, global team environment.
• Handles special assignments promptly and professionally.
• Sets a high standard of ethics, professionalism, leadership, and competency.
• Due to ITAR compliance, this position requires candidates to be a U.S. Citizen, Permanent Resident Alien, or Protected Individual per 8 U.S.C. 1324b(a)(3)

Working Conditions

An employee in this position works in a manufacturing environment in which safety, environmental and health concerns may demand constant attention. Strict adherence to corporate policies, rules, and regulations in these areas is required.

The employee occasionally will work near moving mechanical parts and around high voltage. The noise level in the work environment is moderate.

Physical Requirements

While performing the duties of this job, the employee is regularly required to stand and sit. The employee must occasionally lift and/move up to 40 pounds. Specific vision abilities required by this job include close vision and color vision. Must be able to work with lasers, optical systems, and chemicals, such as: organic solvents, acids and bases, oxidants, adhesives, etc.

Safety Requirements

All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.

Quality and Environmental Responsibilities

Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

Culture Commitment

Ensure adherence to company's values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity - Create an Environment of Trust

Collaboration - Innovate Through the Sharing of Ideas

Accountability - Own the Process and the Outcome

Respect - Recognize the Value in Everyone

Enthusiasm - Find a Sense of Purpose in Work

Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com .Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program. It's an exciting opportunity to work for a company that offers stability, longevity and growth. Come Join Us!

Note to recruiters and employment agencies: We will not pay for unsolicited resumes from recruiters and employment agencies unless we have a signed agreement and have required assistance, in writing, for a specific opening.The Lead Fabrication Process Engineer proactively works with a team of engineers, technicians, and operators on projects and specific tasks related to the manufacturing of wide bandgap semiconductor substrates. Establishes comprehensive ownership of the Fabrication wafering process; develops, optimizes, and sustains all elements of wafer slicing and grinding. Establishes process capability and reliability benchmarks using Statistical Process Control methodologies. Actively participates in Engineering and R& D projects and commercial substrate manufacturing.