职位概述 我们正在寻找-位注重细节, 经验丰富的PCB Layout工程师'加入我们的电力电子研发团队。您将专注新型配电产品中各类电力电子产品的PCB(包括控制板, 电源板及大功率功率板)物理设计。您是实现产品高性能, 高可靠性和可制造性的关键-环'直接影响到产品的电气性能, 散热与EMC表现。 主要职责 --PCB物理设计: 根据硬件工程师提供的设计规范'独立完成多层板的布局布线工作。负责包括控制板(高速数字/模拟信号), 电源板(中等功率)及功率板(高电压, 大电流)在内的所有类型PCB设计。 --协同设计与规则制定: 与硬件工程师紧密合作'理解和消化需求'共同制定详细的PCB布局布线约束规则。针对安规, 信号完整性, 电源完整性和热管理要求'提供最优的布局方案和布线策略。 --电力电子专项设计: 功率回路设计: 优化高电压, 大电流路径的布局'最小化寄生电感和回路面积。 --EMC与安规设计: 在布局中严格保证电气间隙与爬电距离'通过优化地平面, 屏蔽和滤波器布局来提升EMC性能。 --热设计: 为功率器件和发热元件设计有效的散热路径'包括热焊盘, 过孔阵列及与散热器的接口配合。 --信号完整性: 确保关键敏感信号(如采样, 驱动信号)的完整性'避免干扰。 --设计输出与文档: 生成所有必要的生产文件(Gerber, 钻孔文件, 装配图, 钢网文件等)。创建并维护元器件封装库'确保其准确性和可制造性。编写Layout设计说明文档。 --设计验证与支持: 参与PCB设计评审'支持SI/PI/热仿真工程师完成前期仿真。协助解决试产, 量产及测试中遇到的PCB相关技术问题。

Position Overview

We are seeking a detail-oriented and experienced PCB Layout Engineer to join our power electronics R& D team. You will focus on the physical design of PCBs (including control boards, power supply boards, and high-power boards) for various power electronic products in new power distribution systems. You will be a critical link in achieving high performance, reliability, and manufacturability, directly impacting the product's electrical performance, thermal management, and EMC performance.

Key Responsibilities

PCB Physical Design:

• Independently complete the layout and routing of multi-layer boards based on design specifications provided by hardware engineers.
• Responsible for designing all types of PCBs, including control boards (high-speed digital/analog signals), power supply boards (medium power), and high-power boards (high voltage, high current).

Collaborative Design & Rule Definition:

• Work closely with hardware engineers to understand and interpret requirements, and jointly define detailed PCB layout and routing constraint rules.
• Provide optimal placement and routing strategies considering safety, signal integrity, power integrity, and thermal management requirements.

Power Electronics-Specific Design:

• Power Loop Design: Optimize the layout of high-voltage and high-current paths to minimize parasitic inductance and loop area.
• EMC & Safety Design: Strictly ensure creepage and clearance distances in the layout; enhance EMC performance by optimizing ground planes, shielding, and filter placement.
• Thermal Design: Design effective thermal dissipation paths for power devices and heat-generating components, including thermal pads, via arrays, and interface coordination with heat sinks.
• Signal Integrity: Ensure the integrity of critical sensitive signals (e.g., sampling, gate drive signals) and avoid interference.

Design Output & Documentation:

• Generate all necessary production files (Gerber, drill files, assembly drawings, solder paste stencil files, etc.).
• Create and maintain component footprint libraries, ensuring their accuracy and manufacturability.
• Prepare PCB layout design documentation.

Design Verification & Support:

• Participate in PCB design reviews; support SI/PI/thermal simulation engineers in pre-layout and post-layout simulations.
• Assist in resolving PCB-related technical issues encountered during prototyping, mass production, and testing.

Qualifications

任职要求 --教育背景: 专科及以上学历'电子工程, 通信工程, 自动化或相关专业。 工作经验: 3年以上高速, 高密度或高功率PCB Layout设计经验。有光伏逆变器, 储能变流器, UPS, 伺服驱动器, 大功率电源等电力电子产品设计经验者优先。 --专业技能: 设计工具: 精通 Cadence Allegro 等主流EDA设计工具。 专业知识: 深刻理解PCB制造工艺(层压, 孔铜, 表面处理等)及SMT装配流程。 电气知识: 熟悉IPC标准'具备基本的电路知识'能够理解原理图。 专项能力: 对高速数字电路, 模拟电路, 功率电路和RF电路的布局布线有深入理解'能独立解决相关的SI, PI, EMC, 热设计问题。 --核心素质: 具备较强的责任心, 耐心和严谨细致的工作态度。 优秀的沟通能力和团队协作精神'能够高效地与硬件工程师协同工作。 具备优秀的问题分析能力和解决能力'能够承受压力。 --优先考虑条件 熟悉电力电子产品常见的安规标准(如UL 60950-1, UL 1741)及其对PCB布局的要求。 具备完整完成PCB设计项目经历者优先。"

Qualifications & Requirements

Education:

• Associate degree or higher in Electronic Engineering, Communication Engineering, Automation, or a related field.

Experience:

• 3+ years of experience in high-speed, high-density, or high-power PCB layout design. Experience with power electronics products such as PV inverters, energy storage converters, UPS, servo drives, and high-power supplies is preferred.

Technical Skills:

• Design Tools: Proficiency in mainstream EDA design tools such as Cadence Allegro.
• Professional Knowledge: Deep understanding of PCB manufacturing processes (lamination, hole plating, surface finishes, etc.) and SMT assembly processes.
• Electrical Knowledge: Familiarity with IPC standards; solid fundamental circuit knowledge and the ability to understand schematics.
• Specialized Skills: In-depth understanding of layout and routing for high-speed digital, analog, power, and RF circuits; ability to independently solve related SI, PI, EMC, and thermal design issues.

Personal Attributes:

• Strong sense of responsibility, patience, and a meticulous, rigorous work attitude.
• Excellent communication skills and teamwork spirit, enabling effective collaboration with hardware engineers.
• Strong problem-analysis and problem-solving abilities, with the capacity to work under pressure.

Preferred Qualifications

• Familiarity with common safety standards for power electronics products (e.g., UL 60950-1, UL 1741) and their requirements for PCB layout.
• Priority given to candidates with experience seeing PCB design projects through their complete lifecycle.

Schedule: Full-time
Req: 009ITF